View TDA8771A_6996571.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

d a t a sh eet product speci?cation file under integrated circuits, ic02 1996 jan 25 integrated circuits TDA8771A triple 8-bit video digital-to-analog converter (dac)
1996 jan 25 2 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A features 8-bit resolution sampling rate up to 35 mhz internal reference voltage regulator no deglitching circuit required large output voltage range 1k w output load power dissipation only 200 mw single 5 v power supply 44-pin qfp package. applications general purpose high-speed digital-to-analog conversion digital tv graphic display desktop video processing. general description the TDA8771A is a triple 8-bit video digital-to-analog converter (dac). it converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 mhz. the dacs are based on resistor-string architecture with integrated output buffers. the output voltage range is determined by a built-in reference source. the device is fabricated in a 5 v, cmos process that ensures high functionality with low power dissipation. quick reference data note 1. minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. ordering information symbol parameter conditions min. typ. max. unit v dda analog supply voltage 4.5 5.0 5.5 v v ddd digital supply voltage 4.5 5.0 5.5 v i dda analog supply current r l =1k w ; note 1 10 33 45 ma i ddd digital supply current f clk = 35 mhz - 720ma inl integral non-linearity f clk = 35 mhz; ramp input - 0.5 1 lsb dnl differential non-linearity f clk = 35 mhz; ramp input - 0.25 0.5 lsb f clk(max) maximum clock frequency 35 -- mhz p tot total power dissipation r l =1k w ; f clk = 35 mhz; note 1 45 200 360 mw type number package name description version TDA8771Ah qfp44 plastic quad ?at package; 44 leads (lead length 1.3 mm); body 10 10 1.75 mm sot307-2
1996 jan 25 3 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A block diagram fig.1 block diagram. handbook, full pagewidth mbh039 resistor string msb decoder lsb decoder 4 4 31 resistor string msb decoder lsb decoder 4 4 resistor string msb decoder lsb decoder 4 4 30,29 26,25 4 24 to 21 4 bandgap reference 16 to 13 4 20 to 17 4 5 to 3 4 12 to 9 4 8 34, 37, 38,41 33 36 2,42 6,28 40 44 1 clock input 7,27 32,35,39,43 v dda ddd v reference current input red analog output green analog output blue analog output v ssa ssd v reference voltage decoupling input not connected blue digital inputs (bits b4 to b7) blue digital inputs (bits b0 to b3) green digital inputs (bits g4 to g7) green digital inputs (bits g0 to g3) red digital inputs (bits r4 to r7) red digital inputs (bits r0 to r3) TDA8771A (i ) ref (v ) ref
1996 jan 25 4 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A pinning symbol pin description i ref 1 reference current input for output buffers v ssa1 2 analog supply ground 1 r7 3 red digital input data; bit 7 (msb) r6 4 red digital input data; bit 6 r5 5 red digital input data; bit 5 v ssd1 6 digital supply ground 1 v ddd1 7 digital supply voltage 1 r4 8 red digital input data; bit 4 r3 9 red digital input data; bit 3 r2 10 red digital input data; bit 2 r1 11 red digital input data; bit 1 r0 12 red digital input data; bit 0 (lsb) g7 13 green digital input data; bit 7 (msb) g6 14 green digital input data; bit 6 g5 15 green digital input data; bit 5 g4 16 green digital input data; bit 4 g3 17 green digital input data; bit 3 g2 18 green digital input data; bit 2 g1 19 green digital input data; bit 1 g0 20 green digital input data; bit 0 (lsb) b7 21 blue digital input data; bit 7 (msb) b6 22 blue digital input data; bit 6 b5 23 blue digital input data; bit 5 b4 24 blue digital input data; bit 4 b3 25 blue digital input data; bit 3 b2 26 blue digital input data; bit 2 v ddd2 27 digital supply voltage 2 v ssd2 28 digital supply ground 2 b1 29 blue digital input data; bit 1 b0 30 blue digital input data; bit 0 (lsb) clk 31 clock input v dda1 32 analog supply voltage 1 v ref 33 decoupling input for reference voltage n.c. 34 not connected v dda2 35 analog supply voltage 2 outb 36 blue analog output n.c. 37 not connected n.c. 38 not connected v dda3 39 analog supply voltage 3 outg 40 green analog output
1996 jan 25 5 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A n.c. 41 not connected v ssa2 42 analog supply ground 2 v dda4 43 analog supply voltage 4 outr 44 red analog output symbol pin description fig.2 pin configuration. handbook, full pagewidth 1 2 3 4 5 6 7 8 9 10 11 33 32 31 30 29 28 27 26 25 24 23 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 index corner TDA8771A i ref v ssa1 r7 r6 r5 r4 r3 r2 r1 b6 r0 g7 g6 g5 g4 g3 g2 g1 g0 b7 v ssd2 v ref clk v dda1 v ddd2 b2 b3 b4 v dda2 v dda4 v dda3 outr n.c. outg v ssa2 mbh040 v ssd1 v ddd1 b1 b0 b5 n.c. n.c. n.c. outb
1996 jan 25 6 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A limiting values in accordance with the absolute maximum rating system (iec134). thermal characteristics handling inputs and outputs are protected against electrostatic discharges in normal handling. however, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. symbol parameter min. max. unit v dda analog supply voltage - 0.5 +6.5 v v ddd digital supply voltage - 0.5 +6.5 v d v dd supply voltage difference between v dda and v ddd - 1.0 +1.0 v t stg storage temperature - 55 +150 c t amb operating ambient temperature 0 +70 c t j junction temperature - +125 c symbol parameter value unit r th j-a thermal resistance from junction to ambient in free air 75 k/w
1996 jan 25 7 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A characteristics v dda =v ddd = 4.5 to 5.5 v; v ssa and v ssd shorted together; v dda - v ddd = - 0.5 to +0.5 v; t amb = 0 to 70 c; typical values measured at v dda =v ddd = 5 v and t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supply v dda analog supply voltage 4.5 5.0 5.5 v v ddd digital supply voltage 4.5 5.0 5.5 v i dda analog supply current r l =1k w ; note 1 10 33 45 ma i ddd digital supply current f clk = 35 mhz - 720ma inputs c lock input ( pin 31) v il low level input voltage 0 - 1.2 v v ih high level input voltage 2.0 - v ddd v r, g, b digital inputs ( pins 12 to 8, 5 to 3, 20 to 13, 30, 29 and 26 to 21) v il low level input voltage 0 - 1.2 v v ih high level input voltage 2.0 - v ddd v i ref reference current input for output buffers ( pin 1) i i input current - 0.6 0.7 ma timing; see fig.3 f clk(max) maximum clock frequency 35 -- mhz t cph clock pulse width high 8 -- ns t cpl clock pulse width low 8 -- ns t r clock rise time -- 5ns t f clock fall time -- 6ns t su;dat input data set-up time 4 -- ns t hd;dat input data hold time 4 -- ns voltage reference (pin 33, referenced to v ssa ) v ref output reference voltage 1.180 1.242 1.305 v outputs outb, outr, outg analog outputs ( pins 36, 44 and 40, referenced to v ssa ) for 1k w load ; see table 1 fsr full-scale output voltage range 2.80 2.95 3.10 v v os offset of analog voltage output - 0.25 - v v omax maximum output voltage data inputs = logic 1; note 2 2.95 3.20 3.45 v v omin minimum output voltage data inputs = logic 0; note 2 0.05 0.25 0.45 v thd total harmonic distortion f i = 4.43 mhz; f clk = 35 mhz -- 44 - db z l output load impedance 0.9 1.0 1.1 k w
1996 jan 25 8 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A notes 1. minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. v o is directly proportional to v ref . table 1 input coding and dac output voltages (typical values) transfer function (f clk = 35 mhz) inl integral non-linearity ramp input - 0.5 1 lsb dnl differential non-linearity ramp input - 0.25 0.5 lsb a ct crosstalk dac to dac - 50 -- db dac to dac matching - 1.0 2.0 % switching characteristics (for 1 k w output load); see fig.4 t d input to 50% output delay time full-scale change - 12 - ns t s1 settling time 10% to 90% of full-scale change - 15 - ns t s2 settling time to 1 lsb - 50 - ns output transients (glitches) v g area for 1 lsb change - 1 - lsb ns binary input data (sync = blank = 0) code dac output voltages (v) outb, outr, outg r l =1k w 0000 0000 0 0.262 0000 0001 1 0.273 .... .... . . 1000 0000 128 1.731 .... .... . . 1111 1110 254 3.188 1111 1111 255 3.200 symbol parameter conditions min. typ. max. unit
1996 jan 25 9 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A timing fig.3 input timing. handbook, full pagewidth hd; dat t data input clock input mbb656 - 1 su; dat t cpl t cph t v ih v il v il 50 % 50 % stable fig.4 switching timing. handbook, full pagewidth mbb662 - 3 clock input code 1023 code 0 input code (example of a full-scale input data transition) 10 % 50 % 90 % 1 lsb 1 lsb t d s1 t s2 t v o (1) 714 mv (code 1023) 54 mv (code 0) 50 %
1996 jan 25 10 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A internal circuitry fig.5 internal circuitry. 1/1 page = 296 mm (datasheet) 27 mm mbb658 - 1 v ddd v ssd gnd (a) v dda v ssa (b) dacs resistor string v (c) v dda v ssa (d) v dd v dd v dd v dda v dd gnd dda 125 w (typ.) (a) digital inputs; pins 3 to 5, 8 to 26 and 29 to 31. (b) v ref ; pin 33. (c) i ref ; pin 1. (d) outr, g, b; pins 44, 40 and 36.
1996 jan 25 11 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A application information fig.6 application diagram. analog and digital supplies should be separated and decoupled. supplies are not connected internally. all ground pins must be connected. one ground plane is preferred although it depends on application. see figs 7 and 9 for example of anti-aliasing filter. handbook, full pagewidth mbh041 v ref 100 nf v ssa v dda2 clk b0 b1 v ssd2 r0 g7 g6 g5 g4 g3 g2 g1 g0 b7 v ddd1 10 nf 5 v v ssd1 r4 r3 r2 r1 v dda3 10 nf 5 v v ssa2 1 k w n.c. v dda4 10 nf 5 v v ssa1 r5 r6 r7 1 2 3 4 5 6 7 8 9 10 11 44 43 42 41 40 39 38 37 36 35 34 12 13 14 15 16 17 18 19 20 21 22 33 32 31 30 29 28 27 26 25 24 23 TDA8771A 1 k w v ssa outr v ssa outg v ssa outb v ssa v dda1 10 nf 5 v v ssa v ssd v ssa ref i n.c. n.c. 10 nf 5 v v ssa 1 k w n.c. v ddd2 10 nf 5 v v ssd b2 b3 b4 b5 b6 v ssa 6.8 k w
1996 jan 25 12 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A fig.7 example of anti-aliasing filter for 2.4 v output swing. handbook, full pagewidth mbh042 56 pf 150 pf 56 pf 820 w 18 pf 18 pf 12 m h 12 m h analog video output (r,g or b) 2.4 v (p-p) w 125 outr (pin 44) and outg (pin 40) and outb (pin 36) TDA8771A analog ground w 180 fig.8 frequency response for filter shown in fig.7. 1/2 page (datasheet) 22 mm 01020 40 0 40 120 160 80 msa693 30 f (mhz) a (db) characteristics of fig.8 order 5; adapted chebyshev ripple r3 0.7 db fat - 3 db = 6.2 mhz f notch = 10.8 mhz.
1996 jan 25 13 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A fig.9 example of anti-aliasing filter for 1.5 v output swing. handbook, full pagewidth mbh043 27 pf 68 pf 27 pf 500 w 6.8 pf 6.8 pf 27 m h 27 m h analog video output (r,g or b) 1.5 v (p-p) w 125 outr (pin 44) and outg (pin 40) and outb (pin 36) TDA8771A analog ground w 500 fig.10 frequency response for filter shown in fig.9. 1/2 page (datasheet) 22 mm 01020 40 0 40 120 160 80 msa694 30 f (mhz) i a (db) characteristics of fig.10 order 5; adapted chebyshev ripple r3 0.25 db fat - 3 db = 5.6 mhz f notch = 11.7 mhz.
1996 jan 25 14 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A package outline unit a 1 a 2 a 3 b p ce (1) eh e ll p z y w v q references outline version european projection issue date iec jedec eiaj mm 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 0.8 1.3 12.9 12.3 1.2 0.8 10 0 o o 0.15 0.1 0.15 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.95 0.55 sot307-2 95-02-04 97-08-01 d (1) (1) (1) 10.1 9.9 h d 12.9 12.3 e z 1.2 0.8 d e e b 11 c e h d z d a z e e v m a x 1 44 34 33 23 22 12 y q a 1 a l p detail x l (a ) 3 a 2 pin 1 index d h v m b b p b p w m w m 0 2.5 5 mm scale qfp44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm sot307-2 a max. 2.10
1996 jan 25 15 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). re?ow soldering reflow soldering techniques are suitable for all qfp packages. the choice of heating method may be influenced by larger plastic qfp packages (44 leads, or more). if infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. for more information, refer to the drypack chapter in our quality reference handbook (order code 9397 750 00192). reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. wave soldering wave soldering is not recommended for qfp packages. this is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. if wave soldering cannot be avoided, the following conditions must be observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. even with these conditions, do not consider wave soldering the following packages: qfp52 (sot379-1), qfp100 (sot317-1), qfp100 (sot317-2), qfp100 (sot382-1) or qfp160 (sot322-1). during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. repairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1996 jan 25 16 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1996 jan 25 17 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A notes
1996 jan 25 18 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A notes
1996 jan 25 19 philips semiconductors product speci?cation triple 8-bit video digital-to-analog converter (dac) TDA8771A notes
philips semiconductors C a worldwide company argentina: ierod, av. juramento 1992 - 14.b, (1428) buenos aires, tel. (541)786 7633, fax. (541)786 9367 australia: 34 waterloo road, north ryde, nsw 2113, tel. (02)805 4455, fax. (02)805 4466 austria: triester str. 64, a-1101 wien, p.o. box 213, tel. (01)60 101-1236, fax. (01)60 101-1211 belgium: postbus 90050, 5600 pb eindhoven, the netherlands, tel. (31)40-2783749, fax. (31)40-2788399 brazil: rua do rocio 220 - 5 th floor, suite 51, cep: 04552-903-s?o paulo-sp, brazil, p.o. box 7383 (01064-970), tel. (011)821-2333, fax. (011)829-1849 canada: philips semiconductors/components: tel. (800) 234-7381, fax. (708) 296-8556 chile: av. santa maria 0760, santiago, tel. (02)773 816, fax. (02)777 6730 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. (852)2319 7888, fax. (852)2319 7700 colombia: iprelenso ltda, carrera 21 no. 56-17, 77621 bogota, tel. (571)249 7624/(571)217 4609, fax. (571)217 4549 denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. (45)32 88 26 36, fax. (45)31 57 19 49 finland: sinikalliontie 3, fin-02630 espoo, tel. (358)0-615 800, fax. (358)0-61580 920 france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. (01)4099 6161, fax. (01)4099 6427 germany: p.o. box 10 51 40, 20035 hamburg, tel. (040)23 53 60, fax. (040)23 53 63 00 greece: no. 15, 25th march street, gr 17778 tavros, tel. (01)4894 339/4894 911, fax. (01)4814 240 india: philips india ltd, shivsagar estate, a block, dr. annie besant rd. worli, bombay 400 018 tel. (022)4938 541, fax. (022)4938 722 indonesia: philips house, jalan h.r. rasuna said kav. 3-4, p.o. box 4252, jakarta 12950, tel. (021)5201 122, fax. (021)5205 189 ireland: newstead, clonskeagh, dublin 14, tel. (01)7640 000, fax. (01)7640 200 italy: philips semiconductors s.r.l., piazza iv novembre 3, 20124 milano, tel. (0039)2 6752 2531, fax. (0039)2 6752 2557 japan: philips bldg 13-37, kohnan 2 -chome, minato-ku, tokyo 108, tel. (03)3740 5130, fax. (03)3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. (02)709-1412, fax. (02)709-1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. (03)750 5214, fax. (03)757 4880 mexico: 5900 gateway east, suite 200, el paso, tx 79905, tel. 9-5(800)234-7381, fax. (708)296-8556 netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. (040)2783749, fax. (040)2788399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. (09)849-4160, fax. (09)849-7811 norway: box 1, manglerud 0612, oslo, tel. (022)74 8000, fax. (022)74 8341 pakistan: philips electrical industries of pakistan ltd., exchange bldg. st-2/a, block 9, kda scheme 5, clifton, karachi 75600, tel. (021)587 4641-49, fax. (021)577035/5874546 philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. (63) 2 816 6380, fax. (63) 2 817 3474 portugal: philips portuguesa, s.a., rua dr. antnio loureiro borges 5, arquiparque - miraflores, apartado 300, 2795 linda-a-velha, tel. (01)4163160/4163333, fax. (01)4163174/4163366 singapore: lorong 1, toa payoh, singapore 1231, tel. (65)350 2000, fax. (65)251 6500 south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430, johannesburg 2000, tel. (011)470-5911, fax. (011)470-5494 spain: balmes 22, 08007 barcelona, tel. (03)301 6312, fax. (03)301 42 43 sweden: kottbygatan 7, akalla. s-164 85 stockholm, tel. (0)8-632 2000, fax. (0)8-632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. (01)488 2211, fax. (01)481 77 30 taiwan: philips taiwan ltd., 23-30f, 66, chung hsiao west road, sec. 1. taipeh, taiwan roc, p.o. box 22978, taipei 100, tel. (886) 2 382 4443, fax. (886) 2 382 4444 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, thailand, tel. (66) 2 745-4090, fax. (66) 2 398-0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. (0 212)279 27 70, fax. (0212)282 67 07 ukraine: philips ukraine, 2a akademika koroleva str., office 165, 252148 kiev, tel. 380-44-4760297, fax. 380-44-4766991 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. (0181)730-5000, fax. (0181)754-8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. (800)234-7381, fax. (708)296-8556 uruguay: coronel mora 433, montevideo, tel. (02)70-4044, fax. (02)92 0601 internet: http://www.semiconductors.philips.com/ps/ for all other countries apply to: philips semiconductors, international marketing and sales, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, telex 35000 phtcnl, fax. +31-40-2724825 scds47 ? philips electronics n.v. 1996 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. printed in the netherlands 537021/1100/01/pp20 date of release: 1996 jan 25 document order number: 9397 750 00591

▲Up To Search▲

Price & Availability of TDA8771A

	To Download TDA8771A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .